XperYenZ™ 3D Imaging. Simultaneous depth measurement, high-resolution 2D image capture and material classification.

Technology

 

XperYenZ™ imaging systems capture 3 features simultaneously:

  • 2D image information
  • Depth information
  • Material classification

XperYenZ™ technology is based on beam profile analysis. The analysis is done with the efficient XperYenZ™ algorithms. Thus the hardware can be built of easily customizable off-the-shelf components.

  • CMOS camera
  • Simple projector for grid of lights points
  • XperYenZ™ algorithms

Based on proprietary technology (patent pending), XperYenZ™ can also enable you to enter markets which are currently out of reach due to competitors' patents.

 
XperYenZ™ sensor systems determine distance from beam profile properties
 

Key benefits

Key benefits

Industrial applications such as robot navigation or fill level measurement

Mobile application such as face verification, augmented reality or gesture control

Solid-state 3D scanning requiring low computational power

Depth measurement

Simultaneous depth measurement and high resolution

Cost-efficient and easy to integrate

Single camera setup with customizable field of view

Fast algorithm with energy-efficient use of current GPU technology

3D imaging system

 

XperYenZ™ imaging system for industrial applications

XperYenZ™ imaging system for industrial applications

Exemplary specifications

Resolution (CMOS):

2 Mp

Measurement speed:

30 HZ

Field of view (depth):

50° x 38°

N (depth):

1000 points

Wavelength:

850 nm

Measurement range:

250 - 1500 mm

Accuracy:

10 mm (at 1000 mm)

Size:

36 x 88 x 39 mm

These characteristics are specifications of the demonstrator. They are not limitations for a product.

 

XperYenZ™ imaging system for mobile applications

XperYenZ™ imaging system for mobile applications

Miniaturized XperYenZ™ system

Size:

32 x 8 x 4 mm

Integration:

Mobile devices such as smartphones or smartglasses

Possible applications:

3D face verification, gesture control, home robotics

Prototype specifications to follow

Bin picking

 

The XperYenZ™ imaging system is perfectly suitable for the application of bin picking. Its small footprint and light weight makes installation even on small robots with low payload feasible. Continuous high-speed measurement (60 fps and up) of the sensor allows for very fast pick point recognition. The robust RGB-D sensing enables 3D bin picking and object recognition (e.g sort by color or QR code).