News

Hertzstück™ Future Dining Room

 

Hertzstück™: Sees things that the human eye can’t

 

Knowledge is a key for making informed and healthy life decisions. But sometimes, visible information is not enough. With Hertzstück™, we are determined to provide a new, empowering knowledge tool which enables all of us to better control the things we eat, the clothes we wear or the medicines we take. By using near-infrared spectroscopy and transforming the spectra into data that everyone can understand, Hertzstück™ makes the invisible visible and broadens our knowledge of the world around us.

We presented this prototype spectrometer during the London Restaurant Festival 2018 in the pop-up restaurant Hertzstück™ Future Dining Room. For more information, pictures and videos about this event, please feel free to visit basf.com/hertzstueck.

 

 

 

Sep 28, 2018: trinamiX GmbH receives ISO certification

 
Dr. Ingmar Bruder and Dr. Wilfried Hermes after the successful audit
 

trinamiX GmbH receives ISO certification for its quality management system

Ludwigshafen, September 28, 2018 - trinamiX GmbH has received the DIN EN ISO 9001:2015 certificate for the development, production and sales of optical sensor systems by the independent testing and certification body of TÜV Hessen.

The quality management standard ISO 9001 is the most widely used and most important standard in quality management, both nationally and internationally. Dr. Ingmar Bruder, Managing Director of trinamiX GmbH: „We are very proud of this certificate. It is a proof of the commitment and high standards we place on ourselves and our products.“

To obtain the certification according to DIN ISO 9001: 2015, trinamiX presented a comprehensive quality management process. From product development through relationship management to customer-oriented, continuous optimization, all work steps are described. In addition, efficient workflows, transparency, and clear responsibilities within the company were key to obtaining the certification. The audit team were particularly impressed by the very constructive and innovative communication in the company.

"Our goal is high quality products and satisfied customers. The audit and the preparation for it helped us to align our processes even more consistently to this goal and firmly anchor our quality management processes in the company”, explains Dr. Wilfried Hermes, Department Leader IR Sensing and quality management representative of trinamiX.

VISION: November 06 - 08, 2018.

 
trinamiX Booth at Trade Fair Vision
 

At this year's Trade Fair Vision in Stuttgart we showcased our 3D imaging technology and a solution for bin picking.

Thanks to everyone visiting trinamiX. It was a great pleasure for us to meet you!

Film about BASF-Start-Up trinamiX: "We drive innovation"

 

A 10 minute video about trinamiX (source: BASF Inside TV-Magazin, in German, subtitle: english).

Measurement Fair SENSOR+TEST June 26 - 28, 2018.

 
trinamiX stand at Sensor+Test in Nürnberg.
 

The trinamiX team showcased various Hertzstück™ innovations, the XperYenZ™ imaging system and the world´s first fiber optic sensor which can measure absolute distance through optical fibers.

Publication of "FIP - Focused-Induced Photorespose" in Nature Scientific Reports.

 
 

The FIP technique operates on a working principle, which is fundamentally different from all established distance measurement methods and hence offers a way to overcome some of their limitations."

We are happy about the publication of "FIP - Focused-Induced Photorespose" in Nature Scientific Reports.

http://www.nature.com/articles/s41598-018-27475-1

To learn more about FIP use following link: http://www.trinamix.de/FIP

International Trade Fair ANALYTICA April 10 - 13, 2018.

 
Booth at the international Trade Fair ANALYTICA in Munich.
 

The international Trade Fair ANALYTICA in Munich was the first fair where trinamiX presented the sensors of Hertzstück™.

Our highlights at our booth were:

  • TO-packaged infrared detectors with higher stability through double encapsulation
  • Bare chip infrared detectors with new thin-film encapsulation readily bondable